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Surface MEMS

Principal FBK-CMM research investigator is the MEMS Unit.

we have deep expertise in surface micromachined structures, using either electroplated metal or PECVD dielectric low stress structural layers. low temperature processing (<120C) enables the use of photoresist as a sacrificial layer. RF switch devices are available on a fully characterized multy-project wafer platform with standard design rules.

Technology type: 
MEMS
Application cases: 
RF switches, ultrasonic transducers (CMUT)
Market area: 
Sensors and transducers
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