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Surface MEMS
Principal FBK-CMM research investigator is the MEMS Unit.
we have deep expertise in surface micromachined structures, using either electroplated metal or PECVD dielectric low stress structural layers. low temperature processing (<120C) enables the use of photoresist as a sacrificial layer. RF switch devices are available on a fully characterized multy-project wafer platform with standard design rules.
Technology type:
MEMS
Application cases:
RF switches, ultrasonic transducers (CMUT)
Market area:
Sensors and transducers
Telecomunication
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Research topics:
