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Bulk MEMS

Principal FBK-CMM research investigator is the BioMEMS Unit.

Deep 3D micromechanical  structures are fabricated using DRIE and TMAH etching. Suspended structures are used for heat transfer devices (flow measurement), microheaters and strain sensors (pressure measurement). Silicon complex structures can be realized with multi-level DRIE processing. Microfluidics chips and molds can be realized with multilevel deep silicon etching allowing both large area channels and sharp features (up to aspect ratio 1/30) on the same chip. Glass drilling combined with anodic bonding allows for microfluidics chips with complex fluidic patterns.

Technology type: 
MEMS
Application cases: 
pressure sensors, accelerometers, flow sensors, micrometer accuracy vibrating structures and complex molds
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