We can coat 6 inch wafers in thickness range between 300-700um, with single or double side coating of the following:
note: thickness ranges may be extended to meet specific needs.
We offer R&D microfabrication processing, starting from one of our technology platforms or from scratch. We provide highly qualified know-how based on our 20 years experience to help you develop your custom technology. We can realize your prototypes and demonstrators as well as small production batches and technology transfer. Device multiphysics domain simulation can be provided by our internal partner research units.
We offer our technology platforms for single or multi-project wafer fabrication. We provide you with a complete description of the technology specs as well as design rules. Layout templates with DRC are available for L-Erit (version 14 or above). We will support you providing customized technology splittings, in-line metronomy (thickness, refractive index, resistivity, residual stress), automatic device probing on wafer, custom packaging, full fabrication report. SEM EDX analisys can be provided in house by our partner surface analisys unit.
Please refer to the technology platforms page to have a look at available technologies.
