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Paolo Conci

  • Phone: 04611636486
  • Trento
Publications
  1. Bagolini, Alvise; Picciotto, Antonino; Crivellari, Michele; Conci, Paolo; Bellutti, Pierluigi,
    PECVD silicon-rich nitride and low stress nitride films mechanical characterization using membrane point load deflection,
    in «JOURNAL OF MICROMECHANICS AND MICROENGINEERING»,
    vol. 26,
    n. 2,
    2016
    , pp. 025004 -
  2. A. Bagolini; M. Boscardin; P. Conci; M. Crivellari; G. Giacomini; F. Mattedi; C. Piemonte; S. Ronchin; N. Zorzi; M.A. Benkechkache; G.-F. Dalla Betta; R. Mendicino; L. Pancheri; M. Povoli; D.M.S. Sultan,
    Proceedings of the 18th Conference on Sensors and Microsystems AISEM 2015,
    IEEE,
    2015
    , pp. 1-
    4
    , (XVIII AISEM Annual Conference,
    Trento (Italy),
    3-5 February 2015)
  3. A. Bagolini; M. Boscardin; P. Conci; M. Crivellari; G. Giacomini; F. Mattedi; C. Piemonte; S. Ronchin; N. Zorzi; M.A. Benkechkache; G.-F. Dalla Betta; R. Mendicino; L. Pancheri; M. Povoli; D.M.S. Sultan,
    Proceedings of the 18th Conference on Sensors and Microsystems AISEM 2015,
    IEEE,
    2015
    , pp. 1-
    4
    , (XVIII AISEM Annual Conference,
    Trento (Italy),
    3-5 February 2015)
  4. Silvia Pelegrini; Andrea Adami;Cristian Collini; Paolo Conci; Clodoaldo I. L. Araújo; Vittorio Guarnieri; Saulo Güths; André A. Pasa; Leandro Lorenzelli,
    Development and characterization of a microthermoelectric generator with plated copper/constantan thermocouples,
    in «MICROSYSTEM TECHNOLOGIES»,
    vol. 20,
    n. 4-5,
    2014
    , pp. 585 -
    592
  5. M. Boscardin; P. Conci; M. Crivellari; S. Ronchin; S. Bettarini; F. Bosi.,
    Silicon Buried Channels for Pixel Detector Cooling,
    in «NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT»,
    vol. 718,
    2013
    , pp. 297 -
    298
  6. S. Pelegrini; A. Adami; C. Collini; P. Conci; L. Lorenzelli; A. A. Pasa,
    Simulation, design and fabrication of a planar micro thermoelectric generator,
    Proceedings of SPIE 8763, Smart Sensors, Actuators and MEMS,
    vol.VI,
    2013
    , pp. 876322-
    , (SPIE Microtechnologies for the new Millenium 2013,
    Grenoble,
    24-26 April 2013)
  7. S. Pelegrini; A. Adami; C. Collini; P. Conci; L. Lorenzelli; A. A. Pasa,
    Development of a low cost planar micro thermoelectric generator,
    in «LECTURE NOTES IN ELECTRICAL ENGINEERING»
    Lecture Notes in Electrical Engineering,
    2013
    , (AISEM 2013,
    Brescia,
    February 5th- 7th 2013)
  8. P.conci,
    FBK Mobility final report-Electrodeposition of SnAg solders for Wafer Level Packaging,
    The project aimed at developing and optimizing a technological step in particular the Electrodeposition (ECD) process of Sn and Ag alloy that is be considered a key process in the WLP technologies.
    The project was hosted by the IMB-CNM, Instituto de Microelectrónica de Barcelona. At the IMB-CNM, the largest public microelectronics research and development center in Spain, there are leading knowledge and competence in the field of the electrodeposition. There is a signed general agreement between FBK and IMB-CNM to expand existing contacts and ongoing scientific collaborations between the two institutions in the field of “Micro and Nano Integrated System”, and this project implemented a bilateral co-operation in developing a building block technology for microsystems.
    ,
    2013
  9. A.Q.A. Qureshi; S. Colpo; D. Vasilache; S. Girardi; P. Conci; B. Margesin,
    Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer,
    vol.1,
    2012
    , pp. 183-
    186
    , (2012 International Semiconductor Conference (CAS 2012),
    Sinaia, Romania,
    15-17 October)
  10. M. Boscardin; P. Conci; M. Crivellari; S. Ronchin; S. Bettarini; F. Bosi,
    Frontier Detectors For Frontier Physics,
    La Biodola, Isola d'Elba, Italy,
    da 05/20/2012 to 05/26/2012,

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